Gold or solder dip.
Ceramic chip carrier.
Variety of body sizes.
I updated 10 05 ceramic chip carrier magazine type a b and d 68 pin leadless co 006.
Plastic magazine plug family co 022.
Commercial quasi hermetic smt package.
Clcc ceramic leadless chip carrier mm inch unit.
Ceramic leaded chip carrier cqfj the ceramic quad flat pack continues to be popular in various surface mount applications.
Tapepak plug family coinstack magazine.
Other forms are proprietary.
In high heat dissipation applications this proves to be an ideal package.
12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf.
The external lead frame is formed into a j shape to allow for socketing or direct board soldering.
Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications.
Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as jedec.
17 84 lead ceramic leaded cl chip carrier with window square cerquad.
Chip carriers may be made of ceramic or plastic.
Solder glass or epoxy seal.
1st 2nd 3rd total seal ring die attach a x b c x d e x.
Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.
Ceramic chip carrier cerquad family 68 lead ceramic leaded cl chip carrier with window square cerquad.
Fully hermetic smt package.
Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.
Carrier outlines co family registration no.
Plastic magazine family coinstack co 021.
Leadless chip carriers are ideal for surface mount applications.
Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount.
Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or.
The leadless chip carrier s low profile multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and bottom of the package.
Chip carriers can be smaller than dual in line packages and since they use all four edges of the package they can have a larger pin count.
Castellations instead external leads.
Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.
Footprint compatible with cqjb and plcc.
Socket or surface mount package.
Package outline material information.
18 small outline transistor family.
