Ceramic Dip Package

Material properties process flow.

Ceramic dip package.

Package outline material information. Both passive or active devices may be found using ceramic packages. Standard dip with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart. Another example of a ceramic.

Ceramic substrates for probe cards. Spst x 4 two complementary pairs per package. Cerdip ceramic q ceramic dual inline package glass seal package drawing q filter packages by entering lead count or product description into the search box below. Packages come in many forms including dip dual inline sip single inline and pga pin grid array pin insertion types and surface mount types including j lead flat lead gull wing leadless bga ball grid array lga land grid array csp chip size package and other types.

Spst x 4 two complementary pairs per package. Standard packages and lids for device evaluation. The most commonly found ceramic dip packages have an inter lead spacing or lead pitch of 0 1 inch 2 54 mm. Like dip but with staggered zig zag pins.

14 lead cerdip q 14 pdf. Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. Medical and healthcare. And having a row spacing associated with body width varies depending on lead counts with 0 3 in.

Non standard dip with smaller 0 07 in 1 78 mm pin spacing. 7 62 mm or 0 6 inch 15 24 mm. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities.

Ceramic packages for large scale integration lsi devices.